There are two types of full-time graduate programs offered in all SUSTech colleges and departments: PhD Program and Integrated Master-PhD Program. Both types of programs are taught in English.
The PhD Program is for four years. The Integrated Master-PhD Program is for five years (two years for Master and the other three years for PhD).
Materials characterization and microelectronic package structure design, processing optimization and product reliability: Characterization and failure mechanisms study of microelectronic packaging materials; apply state-of-the-art technology (e.g., DfR or Machine Learning) for microelectronics packaging structural design, process optimization and product reliability improvement.
Intelligent manufacturing and inspection system development: Utilize intelligent instruments and automated inspection technology to improve the process of data acquisition and intelligent status perception for traditional manufacturing industry, analyze collected data resource with Artificial Intelligence / Machine Learning tools for intelligent decision making in the technology process.
Intelligent composites for light-weight robots: The embedded piezoresistive sensor provides a new idea for promoting the practical application of health monitoring technique in composite structures. This project investigates the sensing mechanism of embedded graphene piezoresistive sensor and establishes a model for predicting the performance of sensor in complex working condition. A fast response, wide-band, integrable, and highly reliable piezoresistive sensor formed by this project can provide support for the in-service safety assurance of robots’ composite structures.
Expected September 2024
Southern University of Science and Technology (SUSTech)
1088 Xueyuan Avenue,
Shenzhen,
Guangdong,
518055, China
Bachelor’s degree holder for Integrated Master-PhD Program applicants. Master’s degree holder for PhD Program applicants.
Language competence: TOEFL 85 or above; or IELTS 6.5 overall or above, with no sub-scores lower than 6.0.
Application deadlines are Jan/10 for round 1; Apr/10 for round 2.