Fees

Award value

50% of fees

Fees

Funding type

Fee waiver/discount

Fees

Deadline

Expected August 2027

Fees

Study level

Undergraduate, Postgraduate

About this scholarship

Awarding Institution

Bond University

Number of awards

Not specified

What does this scholarship cover?

  • Tuition fees

More details on the scholarship

Provides 50% tuition remission for any undergraduate degree including approved combined programs up to 320 credit points (excluding the Bond Medical Program), or postgraduate degree (excluding research degrees).

Entry requirements

Nationality

All International

Gender

Applicable to all genders

Delivery mode

All types of delivery mode

Selection approach

All eligible students

Study mode

Full time

Intake year

All intakes

Other criteria

Mature students

Course subject and study level you are applying for

Subject area(s)*

Not subject specific

Study level

Undergraduate

Subject area(s)*

Not subject specific

Study level

Postgraduate

Other eligibility requirements

To be eligible to apply for this scholarship, you must:

  • Have strong leadership skills, community involvement and demonstrated potential to affect change;
  • Have had extensive involvement in extracurricular activities; and
  • Meet the entry requirements for your chosen program of study and commence in the following January semester.

What are the obligations of this scholarship?

  • Transformer Scholarship recipients are expected to actively participate in and complete the Transformer program during their academic degree program. Participation in the Transformer commences immediately with academic studies.
  • Suspension of participation in the Transformer program for academic or other reasons will result in termination of scholarship funding.
  • Scholarship recipients must comply with Bond’s general scholarship terms and conditions.
  • The quality of the pitch video is the student’s responsibility. The video submitted and received within the entry period is the version that will be judged. No subsequent versions will be accepted after the closing date.
  • Video submissions must not include copyright material.
  • The University may use excerpts of the videos submitted for entry for teaching purposes and to promote the competition to the public by whatever means it sees fit. This includes online, print and multimedia. We retain this right indefinitely.

How to apply

Application process

You need to apply separately for this scholarship

Application details (from the awarding institution)

If you meet the eligibility criteria for this scholarship, we encourage you to apply by following the below steps:

  • Complete the Bond University Study Application Form to lodge your application for your chosen program. Learn more about this process.
  • Complete the Bond University Scholarship Application Form. Simply use the same log-in details as used for your study application and enter 'scholarship' in the keyword field on the 'Start an Application' tab.  

You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered

Application deadline

Expected August 2027

Contact Institution

Contact the institution for more details on the application process, eligibility, and any other information about the scholarship and courses offered.

Contact university

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